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FS-100GB Thermal Pad
The silicone elastomer with reforcement carrier on one side.  Lower interface contact resistance result in better thermal performance.  Better shock cushioning as the pad can be half of the thickness under great pressure.  Since the pad can receive more pressure, the bond line is very thinner, which generates better thermal performance.  Shock-absorbing & vibration-dampening materials for fragile components.
   You are here:Home >> News >> News
· Bornsun Shows Up on CEBIT, Germany 2010-02-26
· ZTE Shake hands with Bornsun 2009-12-30
· Dell Confirmed Us as A Fixed Supplier 2009-12-16
· National R& D Project with Huawei Technology 2009-06-01
· Joint Laboratory with Tsinghua University 2009-05-24
· Check the training courses for every department 2010-01-08
· R& D Cooperation with Changhong Electronics 2009-05-01
· ISO 14001:2000 Discussion Meeting 2010-01-06
· Get ISO/TS 16949 Certificate 2008-04-01
· Bornsun Suzhou Subsidiary Registered 2006-05-01
· Become a Member of Shenzhen Hi-Tech Enterprise Association 2004-12-01
· Honored as Shenzhen Hi-tech Enterprise 2004-10-01

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